This no-clean solder paste flux is designed to make electronic soldering and repair work smoother and more reliable.
Its strong solder-stickiness and clean performance help improve work efficiency, reduce rework effort, and support precise results in delicate PCB and BGA operations.
Main Features
Excellent solder-stickiness for stable and secure solder joints
Excellent anti-wet capacity for controlled soldering
No-clean and lead-free formula for environmental protection
Suitable for multiple PCB reflow processes
Widely used for BGA, PGA, CSP packages, and flip chip operations
Useful for rework, sphere or pin attachment, and BGA rebelling tasks
